IC Chip BGA Reball Stencil Kit Set Solder Template For Samsung HUAWEI HTC MTK Android Soldering Tin Paste

    • History: 7 Orders
    • Model: 301125
    • Shipping Weight: 0.2Kg
    Price: $2.40
    Package:
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    IC Chip BGA Reball Stencil Kit Set Solder Template For Samsung HUAWEI HTC MTK Android Soldering Tin Paste


    Package 1:

    1x A418 Stencil for Samsung HUAWEI HTC MTK Android combination Stencil

    1x MTK A90 Series Stencil

    1x Samsung S5026 Stencil

    Package 2:

    1x A418 Stencil for Samsung HUAWEI HTC MTK Android combination Stencil

    1x MTK A90 Series Stencil

    1x Samsung S5026 Stencil

    1x 35g Soldering Tin Paste

    BGA Reball Stencil Kit

    BGA Reball Stencil Kit

    BGA Reball Stencil Kit

    BGA Reball Stencil Kit

    BGA Reball Stencil Kit

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    *** Dohainii**o@*.comCanada1$4.402018-07-03 04:29:21
    **ID** BENDEHIBAb**aidraa@*.comFrance1$2.402018-03-15 17:23:09
    **v** Pereze**inperezjr3@*.comUnited States1$4.402018-03-02 04:56:24
    **CT** GOMEZv**ogomez2012@*.comUnited States1$4.402017-10-17 05:43:31
    **m** harfordi**xlocalryde@*.comUnited Kingdom1$2.402017-10-13 21:08:15
    **n** tahah**er_taha@*.comSweden1$2.402017-09-25 01:24:08
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