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IC Chip BGA Reball Stencil Kit Set Solder Template For Samsung HUAWEI HTC MTK Android Soldering Tin Paste

  • History: 4 Orders
  • Model: 301125
  • Shipping Weight: 0.2Kg
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Price: $2.40

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IC Chip BGA Reball Stencil Kit Set Solder Template For Samsung HUAWEI HTC MTK Android Soldering Tin Paste


Package 1:

1x A418 Stencil for Samsung HUAWEI HTC MTK Android combination Stencil

1x MTK A90 Series Stencil

1x Samsung S5026 Stencil

Package 2:

1x A418 Stencil for Samsung HUAWEI HTC MTK Android combination Stencil

1x MTK A90 Series Stencil

1x Samsung S5026 Stencil

1x 35g Soldering Tin Paste

BGA Reball Stencil Kit

BGA Reball Stencil Kit

BGA Reball Stencil Kit

BGA Reball Stencil Kit

BGA Reball Stencil Kit

Recently Purchased Products (just show 10 records)

Customers Name Buyer Address Quantity Final Price Order Date
**CT** GOMEZ v**ogomez2012@*.com United States 1 $4.40 2017-10-17 05:43:31
**m** harford i**xlocalryde@*.com United Kingdom 1 $2.40 2017-10-13 21:08:15
**n** taha h**er_taha@*.com Sweden 1 $2.40 2017-09-25 01:24:08
**nstant** Marinescu c**obilesistems@*.com Spain 1 $2.40 2017-09-22 14:50:02

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