Chip Heating Station Soldering Welding Rework Plateform For iPhone NAND CPU A8 A9 BGA IC Removal Disassemble Desoldering Tools

    • History: 4 Orders
    • Model: 301107
    • Shipping Weight: 1Kg
    Price: $185.00
    Qty: Unit(s)
    Shipping:

    Chip Heating Station Soldering Welding Rework Plateform For iPhone NAND CPU A8 A9 BGA IC Removal Disassemble Desoldering Tools

    Product Specification

    Model: 120E

    Temperature Range: 80-300

    Exothermic Material A1326

    Ground Resistance: <2Ω

    Ground Potential: <2mv

    Size: 165x104x45 mm

    Operation: 

    100% brand new, high quality
    Temperature setting parameters:
    demolition shield temperature adjustment 180 - 200
    In addition to CPU side glue temperature to 180 - 200
    demolition A8 A9 CPU the temperature to 230 - 240
    In addition to glue temperature to 180 - 200
    sik tin temperature was adjusted to 180
     
     

    Notice: This package don't include any logic boards and Chips

    Package Including:

    1x Chip Heating Rework Station

    ​1x IC remove tool with 14 pieces blades

    Chip Heating Rework Station

    Chip Heating Rework StationChip Heating Rework StationChip Heating Rework StationChip Heating Rework StationChip Heating Rework Station

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