Your cart is empty

BGA Chip Reball Stencil A8 A9 A10 Soldering Station Iron Welding Flux Fix iPhone 6 6s 7 Plus NAND IC Tools Kit Motherboard

  • History: 0 Orders
  • Model: 301134
  • Shipping Weight: 0.2Kg
Shipping:
Price: $40.00
Qty: Unit(s)




BGA Reball Stencil A8 A9 A10 Solering Stations Iron Fix iPhone 6 6s 7 Plus NAND CPU Chip IC Tools Kits PCB Motherboard

 Feature:

1.This BGA reball stencils can location the IC chip when you repair, it's so convenient. Stable, and accurately. No need IC holder station. 

2.Not like other 3D BGA reball stencils, it can guarantee the stencil touch the solder pad closely during heating

 

Notice:

1.The package don't include any IC.

2.Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same.  

 

Package Including: (for iphone 6 -7 Plus)

1x efix BGA Reball Position Station with 5x Position Pin for iPhone 6 6 plus

1x efix BGA Reball Position Stationwith 5x Position Pin for iPhone 6s 6s plus

1x efix BGA Reball Position Stationwith 5x Position Pin for iPhone 7 7 plus

BGA Reball Position Station

BGA Reball Position Station

BGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position StationBGA Reball Position Station


There are currently no product reviews.
NOTE: Reviews require prior approval before they will be displayed


All goods are not marked are three packs of shops


Top
Service
interrelated