3 PCS/Lot Multifunction IC Chip BGA Reballing Heat Rework Station Stencil Kits Solder template for Samsung iPhone HUAWEI etc

    • History: 21 Orders
    • Model: 301068
    • Shipping Weight: 0.25Kg
    Price: $1.20
    Package:
    Qty: Unit(s)
    Shipping:

    3 PCS/Lot Multifunction IC Chip BGA Reballing Heat Rework Station Stencil Kits Set Solder template for Samsung iPhone HUAWEI etc

     

    Package 1:

    3x Multifunction BGA Reball Stencil

    Package 2:

    3x Multifunction BGA Reball Stencil

     1x Soldering Paste

    Note: 

    Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same.

    Package 1

    BGA Reball Stencil

    Package 2

    BGA Reball Stencil

    BGA Reball Stencil

    BGA Reball Stencil

     

    BGA Reball Stencil

    BGA Reball Stencil


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