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3 PCS/Lot Multifunction IC Chip BGA Reballing Heat Rework Station Stencil Kits Solder template for Samsung iPhone HUAWEI etc

  • History: 19 Orders
  • Model: 301068
  • Shipping Weight: 0.25Kg
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Price: $1.20

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3 PCS/Lot Multifunction IC Chip BGA Reballing Heat Rework Station Stencil Kits Set Solder template for Samsung iPhone HUAWEI etc

 

Package 1:

3x Multifunction BGA Reball Stencil

Package 2:

3x Multifunction BGA Reball Stencil

 1x Soldering Paste

Note: 

Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same.

Package 1

BGA Reball Stencil

Package 2

BGA Reball Stencil

BGA Reball Stencil

BGA Reball Stencil

 

BGA Reball Stencil

BGA Reball Stencil


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